SMART STACKING

[ Silicon chips, semi-conductors, integrated circuits and silicon wafers for micro-electronics, for flat screens, for integrated optical wave guides, for sensors, for imaging devices, and for micro-machining; semiconductor wafers for micro-electronics, for flat screens, for integrated optical wave guides for sensors, for imaging devices, and for micro-machining; silicon wafers, silicon chips, semi-conductors, integrated circuits and silicon wafers for micro-electronics, opto-electronics, photovoltaics and micro-mechanical engineering ]

Processing of base materials for microelectronics, optoelectronics, photovoltaics and micromechanics and all derived activities, namely, silicon wafer bonding treatment, silicon wafer thinning treatment, silicon wafer edge removal treatment, silicon wafer etching treatment and integrated circuits etching treatment of semiconductor silicon wafers for micro-electronics, opto-electronics, photovoltaics and micro-mechanical engineering; processing of wafers of microelectronic components through bonding, for stacked microelectronic structures, namely, treatment of components of silicon wafers for micro-electronics by bonding in order to form stacked micro-electronics structures

[ Research and development of new products for others; research for others in the field of microelectronics; ] engineering services; technical consulting in the field of microelectronics; material testing; [ laboratory research in the field of micro-electronics ]