SB²

Soldering materials for the contact metallization for micro compounds, insofar as included in this class

Machines, namely, automatic machines, regarding micro periphery; machines, namely, automatic machines, for the application of connecting material on substrates; machines, namely, automatic machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, in particular chips, combined to a module

Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; contact metallization for micro compounds of soldering material

Development of contact metallizations for connection technology; development of connecting technologies for producing micro compounds; technological consultancy, in particular regarding the production of micro compounds