PACLINE

Machines, namely, automatic machines, regarding micro periphery; machines, namely, automatic machines, for the application of connecting material on substrates; machines, namely, automatic machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, in particular chips, combined to a module

Material processing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates

Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; contact metallization for micro compounds of soldering material