YOUR COMPLETE CONNECTION

PROVIDING AN ON-LINE DATABASE ON THE INTERNET IN THE FIELD OF BACK-END ASSEMBLY OF SEMICONDUCTORS, NAMELY, AUTOMATIC WIRE BONDING EQUIPMENT, TOOLS AND MATERIALS, BONDER SOFTWARE, DIE ATTACHMENT EQUIPMENT AND TOOLS, DICING EQUIPMENT AND BLADES, FACTORY AUTOMATION PRODUCTS AND SERVICES, LAMINATE TECHNOLOGY SERVICES, MANUAL WIRE BONDING EQUIPMENT, TOOLS AND MATERIALS, PACKAGE SIMULATION EQUIPMENT AND BLADES, SOLDER BALL PLACEMENT EQUIPMENT, WAFER BUMPING EQUIPMENT, TOOLS AND MATERIALS, WAFER BUMPING SERVICES, WAFER PREPARATION EQUIPMENT, AND CUSTOMER SUPPORT SERVICES RELATING THERETO, NAMELY, SUPPLY, LOGISTICS AND SUPPORT AND FACTORY PRODUCTIVITY