Mark Identification

XSP - TRANSFORMABLE SUBTRACTIVE PACKAGE

Serial Number

78120176

Filing Date

Apr 8, 2002

Trademark by

ASE ELECTRONICS (M) SDN. BHD.

AMITEC LTD.

MTBSOLUTIONS INC.

Classification Information

high performance semiconductor packaging technology integrating silicon die and package to create improved component performance, speed and reduced form factor

Advertising and Business