Integrated circuit modules; Electronic integrated circuits; Circuit boards provided with integrated circuits; Semiconductor chips; Computer chips; Integrated circuit modules for use with infrared detectors; Chip carriers, namely, semiconductor chip housings; Integrated circuits; Photoelectric sensors; Infrared sensors; Optical lenses; Optical mirrors; Printed circuit boards; Rearview cameras for vehicles
Electrical and Scientific ApparatusCMOS image sensor packaging in the nature of integrated circuit assembly; Semiconductor packaging in the nature of integrated circuit assembly; Manufacturing processing of semiconductors, wafers, and integrated circuits for others; Assembly of semiconductors, wafers, and integrated circuits for others; Packaging of semiconductors, wafers, and integrated circuits for others in the nature of integrated circuit assembly; Metal laminating; Laminating of plastic, metal, ceramic or glass sheets; Laminating of plastic sheets; Molding of plastic materials
Treatment of Materials