XERDIA

washing apparatus for semiconductor wafers; integrated circuit bonding tools and parts thereof; die bonders for manufacturing semiconductor elements; flip chip bonding equipment for manufacturing semiconductors; semiconductor exposure apparatus for use in manufacture; semiconductor wafer ashing equipment; semiconductor wafer etching equipment; semiconductor wafer processing equipment; die bonding equipment for manufacturing semiconductors; semiconductor wafer processing machines; semiconductor wafer surface polishing equipment; adhesive application equipment for semiconductor manufacturing machines; semiconductor manufacturing machines; machines for attaching tapes of semiconductor wafers; memory chip manufacturing machines; machines for manufacturing semiconductors; plasma etching machines; machines for cutting semiconductor wafers and parts thereof

repair or maintenance of integrated circuits manufacturing machines and systems; repair or maintenance of semiconductor manufacturing machines and systems; providing information relating to the repair or maintenance of integrated circuits manufacturing machines and systems; providing information relating to the repair or maintenance of semi-conductor manufacturing machines and systems