X-AIM

Semiconductor devices; Semiconductor chips; Semiconductor chiplets; Semiconductor dies; Semiconductor integrated circuits; Semiconductor processor chips; Semi-conductor memory units; Graphics processor units (GPUs); Micro processors; Micro-processors; Word processors; Video processors; Data processors; Signal processors; Raster image processors; Digital sound processors; Digital voice signal processors; Data and word processors; Integrated circuit chips; Integrated circuit modules; Integrated circuit module; Integrated circuits, integrated circuit chips, and integrated circuit modules for digital video compression and decompression; Integrated circuits; Electronic integrated circuits; Integrated circuits and integrated circuit cores for use in wireless communications and wireless communication equipment and apparati and digital signal processors (DSP); Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design; Large scale integrated circuits; Very large scale integration (VLSI) semiconductor integrated circuits; Downloadable computer-aided manufacturing (CAM) software for integrated circuits; Computer chipset for use in transmitting data to and from a central processing unit; Computer central processing units; Central processing units for processing information, data, sound or images; Central processing units (CPU); Hardened units composed of microprocessors and integrated transmitters and receivers installed in the field at large scale mining, construction, and industrial sites to collect data from monitoring and control installations, to transmit the data to central processing facilities, and to receive data transmissions directed to the installations; Computer memory hardware; Computer memory devices