X-AIC

Design of semiconductor chips; Design for others of integrated circuits and integrated circuit cores for use in wireless communications and wireless communication equipment and apparati and digital signal processors (DSP); Design of integrated circuits; Design of computer hardware, integrated circuits, communications hardware and software and computer networks for others; Design and development of artificial intelligence (AI) software; Research, design and development of software using artificial intelligence; Design and development of artificial intelligence (AI) software on an outsourcing basis; Software design provided on an outsourcing basis in the field of artificial intelligence; Design of software provided on an outsourcing basis in the field of artificial intelligence; Computer software design provided on an outsourcing basis in the field of artificial intelligence; Software design services provided on an outsourcing basis in the field of artificial intelligence; Design of computer software provided on an outsourcing basis in the field of artificial intelligence; Computer software design services provided on an outsourcing basis in the field of artificial intelligence; Research in the area of semiconductor processing technology; Research in the field of artificial intelligence; Research in the field of artificial intelligence (AI); Research in the field of artificial intelligence technology; Research in the field of artificial intelligence (AI) software; Research in the field of artificial intelligence (AI) technology; Advanced product research in the field of artificial intelligence (AI); Research in the field of computer natural language processing; Research and development of 3D content, 3D technology and processes, stereoscopic 3D projection, 3D animation technology, 3D processing power, 3D techniques, and flexible forward projection