WIN-WIN

Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, network system for wafer probing machine, wafer dicing machine, and dicing machine

Data processing system for coordinate measuring machines; computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; measuring instruments, namely Wafer thickness measuring instrument, Non-contact flatness measuring instrument, Machine control gage, Automatic measuring equipment, Displacement sensor, Electric micrometer, Pneumatic micrometer, Digital length measuring instrument, Laser interference length measuring sensor, Optical fiber laser interferometer measuring system, Surface Texture measuring instrument, Three-dimensional measuring instrument, Surface texture and contour measuring instrument, Contour measuring instrument, Roundness measuring instrument, Roundness and cylindrical/flat profile analysis equipment, and Coordinate measuring machine