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Manufacture of box or system assembly products, printed wire board assemblies, RF and microwave integrated circuits, hybrid microelectronics, LTCC/HTCC substrate and packages, aluminum nitride ceramic substrates and packages, Thick Film Substrates Enhanced Circuits Processing, and Thin Film ceramic substrates, to order and/or specification of others in the defense, aerospace, medical, optoelectronics, space, telecommunications, and commercial industries; assembly of microelectronics and circuit cards for others

Design and development for others of application-specific electronic interface hardware for use in defense, aerospace, medical, optoelectronics, space, telecommunications, and commercial industries