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THERMAL MANAGEMENT SOLUTIONS FOR ELECTRONICS, NAMELY, HEAT DISSIPATION COMPONENTS AND HEAT DISSIPATION ASSEMBLIES; CUSTOM MANUFACTURE OF HEAT DISSIPATION COMPONENTS, HEAT DISSIPATION ASSEMBLIES, AND HEAT DISSIPATION SYSTEMS FOR OTHERS; AND ENGINEERING SERVICES, NAMELY, DESIGN AND ANALYSIS OF HEAT DISSIPATION COMPONENTS, HEAT DISSIPATION SYSTEMS FOR OTHERS