Mark Identification
WAKEFIELD SOLUTIONS
Serial Number
85002128
Filing Date
Mar 30, 2010
Registration Date
Nov 22, 2011
Trademark by
Classification Information
Thermal extrusions and heat sinks for printed circuit boards, namely, high density extrusions, bonded heat sinks, stack and swage fins, folded fin, DC/DC converter, printed circuit board levels, BGA/PGA heat sinks for computers, microprocessor heat sinks, and cold plates and conduction-cooled heat frames for printed circuit boards
Electrical and Scientific Apparatus