WAKEFIELD ON TOP

HEAT DISSIPATION COMPONENTS FOR ELECTRONICS, NAMELY, HEAT SINKS AND FANS FOR USE WITH MICROPROCESSORS, INTEGRATED CIRCUITS, AND APPLICATION-SPECIFIC INTEGRATED CIRCUITS (ASICS); CUSTOM MANUFACTURE OF HEAT DISSIPATION COMPONENTS, HEAT DISSIPATION ASSEMBLIES, AND HEAT DISSIPATION SYSTEMS FOR OTHERS; AND, ENGINEERING SERVICES, NAMELY, DESIGN AND ANALYSIS OF HEAT DISSIPATION COMPONENTS, HEAT DISSIPATION ASSEMBLIES, AND HEAT DISSIPATION SYSTEMS FOR OTHERS