VERTICAL CLOCK DELIVERY

Semiconductor devices and integrated circuits for electronic timing and clock distribution; clock generation circuits, namely, clock oscillators, clock generators, clock buffers, resonators, and MEMS resonators; advanced electronic packaging components for integrating timing devices into heterogeneous integration assemblies, including integrated circuit (IC) packages, chiplet integration platforms, multi-chip modules (MCMs), and electronic system-in-package (SiP) solutions, including those adapted for timing delivery in Chip-on-Wafer-on-Substrate (CoWoS) and System-on-Wafer (SoW) architectures; substrates, carriers, and interconnect components featuring embedded or backside-mounted timing reference devices for supplying clocks and timing signals to graphics processing units (GPUs), central processing units (CPUs), other processing units (XPUs), and associated memory and input/output components