VEM

Oxides and carbides in pellets, granules, tablets, flakes, powder, rod, wire and foil format for thin film coating of substrates and substrate materials for use in the fields of semiconductor, compound semiconductor, wireless radio frequency and microwave, precision optics/laser, photovoltaic/solar, emerging display technologies, data storage, micro-electro-mechanical systems, automotive, aerospace/defense, and ophthalmics; discs and sputtering targets made primarily of oxides and carbides bonded with oxides and carbides used in physical vapor deposition chambers and other manufacturing processes for thin film coating of substrates and substrate materials for use in the fields of semiconductor, compound semiconductor, wireless radio frequency and microwave, precision optics/laser, photovoltaic/solar, emerging display technologies, data storage, micro-electro-mechanical systems, automotive, aerospace/defense, and ophthalmics

Titanium aluminum, tungsten titanium, aluminum silicon, aluminum silicon copper, aluminum copper, gold tin, gold germanium, gold nickel, iron hafnium, iron zirconium, cobalt iron tantalum, nickel chromium silicon, and tungsten silicon alloys, cermets, and refractory compounds, namely, refractory blocks of metal, refractory shapes of metal, fired refractory materials of metal in pellets, granules, tablets, flakes, powder, rod, wire and foil format for thin film coating of substrates and substrate materials for use in the fields of semiconductor, compound semiconductor, wireless radio frequency and microwave, precision optics/laser, photovoltaic/solar, emerging display technologies, data storage, micro-electro-mechanical systems, automotive, aerospace/defense, and ophthalmics; discs and sputtering targets made primarily of metal bonded with titanium aluminum, tungsten titanium, aluminum silicon, aluminum silicon copper, aluminum copper, gold tin, gold germanium, gold nickel, iron hafnium, iron zirconium, cobalt iron tantalum, nickel chromium silicon, and tungsten silicon alloys, cermets, and refractory compounds, namely, refractory blocks of metal, refractory shapes of metal, fired refractory materials of metal used in physical vapor deposition chambers and other manufacturing processes for thin film coating of substrates and substrate materials for use in the fields of semiconductor, compound semiconductor, wireless radio frequency and microwave, precision optics/laser, photovoltaic/solar, emerging display technologies, data storage, micro-electro-mechanical systems, automotive, aerospace/defense, and ophthalmics; Precious and semi-precious metals in pellets, granules, tablets, flakes, powder, rod, wire and foil format for thin film coating of substrates and substrate materials for use in the fields of semiconductor, compound semiconductor, wireless radio frequency and microwave, precision optics/laser, photovoltaic/solar, emerging display technologies, data storage, micro-electro-mechanical systems, automotive, aerospace/defense, and ophthalmics; discs and sputtering targets made primarily of precious and semi-precious metals bonded with precious and semi-precious metals used in physical vapor deposition chambers and other manufacturing processes for thin film coating of substrates and substrate materials for use in the fields of semiconductor, compound semiconductor, wireless radio frequency and microwave, precision optics/laser, photovoltaic/solar, emerging display technologies, data storage, micro-electro-mechanical systems, automotive, aerospace/defense, and ophthalmics