UNOVIS SOLUTIONS

Consulting for others in the field of electronics assembly and processes for assembling semiconductor components; providing information to others in the field of electronics and semiconductor component assembly related to flip chip and die bonding, hybrid module assembly, and mechanical assembly

Research and development in the field of surface mount and insertion mount electronics assembly equipment; engineering services in the field of electronics assembly equipment for customers in the automotive, semiconductor component assembly, telecommunications, and medical markets; design, development and testing of new products for others in the field of electronics assembly equipment