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ELECTRICAL INSULATING MATERIAL, NAMELY, UNIDIRECTIONAL CROSS-PLIED EPOXY E-GLASS FABRIC LAMINATES IN THE FIELD OF PRINTED CIRCUIT BOARD MANUFACTURING FOR USE IN COMPUTERS, COMMUNICATIONS TECHNOLOGY AND IN ELECTRONIC COMPONENTS IN AUTOMOBILES, AVIATION INSTRUMENTS AND MEASURING AND CONTROL CIRCUITS; BASE MATERIALS FOR CIRCUIT BOARDS, ALL IN THE FORM OF FIBER-REINFORCED PLASTIC PANELS AND PANEL BLANKS COATED WITH COPPER; BASE MATERIALS FOR MULTI-LAYER CIRCUIT BOARDS, ALL IN THE FORM OF THIN FIBER-REINFORCED PLASTIC LAMINATES AND PREPREGS, NAMELY ADHESIVE FILMS, COATED WITH COPPER; BASE MATERIALS FOR THE MANUFACTURE OF CIRCUIT BOARDS PRODUCED BY CROSS-PLYING PREPEGS MADE WITH A STABILIZED UNIDIRECTIONAL GLASS FABRIC HAVING A SPECIFIED GLASS WEIGHT, AND A SPECIFIED RESIN CONTENT