ULTIMABOND

Semiconductor manufacturing machines; parts and accessories of semiconductor manufacturing machines; laminated semiconductor chip manufacturing machines; parts and accessories of laminated semiconductor chip manufacturing machines; semiconductor manufacturing equipment components, namely, ceramic substrates for arranging and temporarily bonding semiconductor chips and forming a redistribution layer on a semiconductor substrate in the semiconductor substrate fabrication process; semiconductor manufacturing equipment components, namely, ceramic substrates for processing and transporting semiconductor substrates in the semiconductor substrate fabrication process; semiconductor manufacturing equipment components, namely, ceramic substrates used in the process of semiconductor packaging, including fan-out wafer-level packaging (fowlp); semiconductor manufacturing equipment components, namely, ceramic substrates for holding semiconductor substrates in the semiconductor substrate fabrication process; ceramic heaters for semiconductor manufacturing equipment; electrostatic chucks for semiconductor manufacturing equipment.

Semiconductor wafers; telecommunication machines and apparatus; optical modulators; optical communication devices; quantum computers; quantum dot light-emitting diodes [QLED]; quantum dots [crystalline semi-conductor materials]; quantum sensors [semi-conductor elements]; quantum sensors [electronic components]; electronic components; electrical signal producing devices; wafers and substrates for optical modulators; wafers and substrates for optical communication devices; wafers and substrates for quantum devices; wafers and substrates for electrical signal producing devices; electronic control apparatus for machines; apparatus for processing electronic information; parts of optical modulators, optical communication devices, quantum computers, quantum dot light-emitting diodes [QLED], quantum dots [crystalline semi-conductor materials], quantum sensors [semi-conductor elements], quantum sensors [electronic components], electrical signal producing devices, wafers and substrates for optical modulators, wafers and substrates for optical communication devices, wafers and substrates for quantum devices, wafers and substrates for electrical signal producing devices, electronic control apparatus for machines, apparatus for processing electronic information; integrated circuits and their parts; circuit boards; wafers and substrates for electronic devices; surface acoustic wave filters; wafers and substrates for surface acoustic wave filters; light-emitting diodes; substrates for light-emitting diodes; laser diodes; substrates for laser diodes; ceramic semiconductor wafers; ceramic substrates for electronic circuits used in semiconductor manufacturing processes.