Mark Identification

UCSP

Serial Number

78141122

Filing Date

Jul 3, 2002

Trademark by

FLIP CHIP TECHNOLOGIES LLC

Classification Information

SEMICONDUCTOR PACKAGING FOR MANUFACTURERS OF SEMICONDUCTORS AND DEVICES UTILIZING SEMICONDUCTORS, NAMELY, UNDER BUMP METALIZATION, POLYMER THIN FILM LAYERS AND SOLDER BUMPS CONSTRUCTED ON SEMICONDUCTOR WAFER TO PROTECT THE INTEGRATED CIRCUIT FROM CONTAMINANTS AND MOISTURE AND TO MAKE AN ELECTRICAL CONNECTION BETWEEN THE INTEGRATED CIRCUIT CHIP AND PRINTED CIRCUIT BOARD OR OTHER SUBSTRATES

Electrical and Scientific Apparatus