UCSP

SEMICONDUCTOR PACKAGING FOR MANUFACTURERS OF SEMICONDUCTORS AND DEVICES UTILIZING SEMICONDUCTORS, NAMELY, UNDER BUMP METALIZATION, POLYMER THIN FILM LAYERS AND SOLDER BUMPS CONSTRUCTED ON SEMICONDUCTOR WAFER TO PROTECT THE INTEGRATED CIRCUIT FROM CONTAMINANTS AND MOISTURE AND TO MAKE AN ELECTRICAL CONNECTION BETWEEN THE INTEGRATED CIRCUIT CHIP AND PRINTED CIRCUIT BOARD OR OTHER SUBSTRATES