UBOTIC

Protection devices for manufacturing integrated circuits (IC), chips, electronic and sensor devices for semiconductor and engineering industries which require high precision industrial, material engineering and mechanical structural design, fabrication process design and manufacturing service; sensors and sensor packaging for use with semiconductors and parts and accessories therefore

Printed technical documents

Custom fabrication processing services for semiconductor wafers, sensor wafers or micro electro mechanical systems (MEMS) wafers for manufacturing chips and modules

Custom final testing services, namely, electrical, functional or industrial reliability testing for semiconductor wafers, sensor wafers, micro electro mechanical systems (MEMS) wafers