TSK

Semiconductor manufacturing equipment, namely, semiconductor wafer scrubbing and washing machine, wire slicing machine, wafer slicing machines, slicing machines for non-silicon wafers, sliced wafer carbon emounting and cleaning machine, wafer probing machine, and chemical mechanical planarizers

Precision measuring machines, namely, wafer thickness measuring machine, non-contact flatness measuring machine, digital length measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, three-dimensional measuring machine, contour measuring machine, coordinate measuring machines; data processing for coordinate measuring machines, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer; computer controlled discrete device tester; automatic die selector, namely, computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; electric or magnetic measuring instrument, namely, electric current or voltage detectors, magnetic measuring apparatus, namely, magnetic sensors, capacity measures; optical apparatus, namely, microscopes; electronic machines and instruments and their parts and fittings, namely, ultrasonic depth sounders; automatic distribution vending machines; network system comprised of computer hardware and software for wafer probing machines; wafer inspection units