TRANSCOMP

Molding machines, namely, combined transfer molding and compression molding machines; molding machine parts, namely, molds for use in the manufacture of semiconductor devices, integrated circuit products, semiconductor wafers and semiconductor wafer-related products, panels and panel-related products for integrated circuits and semiconductor devices, light-emitting diodes, light-emitting diode products, and lead frames; transfer molding machines for use in the manufacture of semiconductor devices