TRACIT TECHNOLOGIES

[ Magnetic components, namely, magnetic head, magnetic random access memory; optical devices, namely, optical switches, optical multiplexors; ] silicon circuit boards; semiconductors; silicon circuit boards and semiconductors for printed circuits and integrated circuits; [ micro-electronics circuits ] and micro-mechanics components, namely, pressure sensors, accelerometer, gyro meter, optical sensors, bio-sensors, namely, laboratory equipment in the nature of sensors for sensing DNA; semiconductor wafers for micro-electronics and micro-mechanics, namely, for flat screens, for integrated optical guides, for sensors, for smart cards or microprocessor cards, for magnetic identification cards; micro-electronic circuits, [ micro-systems, namely, bio-sensors, namely, laboratory equipment in the nature of sensors for sensing DNA, pressure sensors, accelerometers, gyro meters; ] assembled semiconductor wafers, particularly by using direct wafer bonding or molecular bonding; electronic circuit or microelectronic circuits or micro-systems, namely, pressure sensors, accelerometer, gyrometer, [ optical sensors, bio-sensors, namely, laboratory equipment in the nature of sensors for sensing DNA, magnetic sensors, namely, laboratory equipment in the nature of sensors for sensing magnetic fields, actuators, namely, microswitches, all transferred onto different types of support materials, such as semiconductor wafers, insulating wafers such as silica, plastic, piezoelectric support, silicon circuit boards with an embedded silica layer, semiconductor circuit boards with buried insulator or oxide layers; ] wafers for fabrication of micro-electronics circuits, or microsystems, namely, pressure sensors, accelerometers, gyrometers, optical sensors, bio-sensors, namely, laboratory equipment in the nature of sensors for sensing DNA, magnetic sensors, namely, laboratory equipment in the nature of sensors for sensing magnetic fields, actuators, namely, micro-switches, piezoelectric sensors

[ Scientific research services; research and development of new products for third parties; research and development of new products for others particularly in the field of silicon circuit boards and semiconductors for new integrated circuits and derived activities, namely, nano-electronics or fabrication of microsystems by technologies coming from microelectronics; research and development of new products for others particularly in the field of transferring microelectronic circuits or micro-systems, namely, pressure sensors, accelerometers, gyrometers, optical sensors, bio-sensors, magnetic sensors, and actuators, onto all types of media and derived activities, namely, nano-electronics or fabrication of microsystems by technologies coming from microelectronics; engineering and technical consultation, particularly in the field of silicon circuit boards and semiconductors for integrated circuits and derived activities, namely, nano-electronics or fabrication of microsystems by technologies coming from microelectronics, and the transfer of microelectronic circuits or micro-systems onto all types of media and derived activities, namely, nano-electronics or fabrication of microsystems by technologies coming from microelectronics; research and development of new products for others, engineering and technical consultation in the field of semiconductor circuit board assembly, particularly with an insulating layer or intermediary oxide layer, and molecular adhesion ]