79165610
Mar 19, 2015
May 3, 2016
Cutting machines for processing semiconductor wafers; abrasive wires being parts of machines; abrasive wires for semiconductor wafer cutting being parts of machines; abrasive wires for cutting ceramic materials being parts of machines; abrasive wires for cutting sapphire being parts of machines; semiconductor cutting machines
MachineryCutting by abrasion; cutting of semiconductor wafers or ceramic materials or sapphires by abrasion; cutting of metals by abrasion; cutting of semiconductor wafers or ceramic materials or sapphires by means of abrasive wires
Treatment of Materials