THE FIRST WORD

soldering flux; water soluble soldering flux; low solids solder flux; soldering flux, zinc chloride type; solder chemicals and antioxidants for use with solder; fluxes used for soldering electronic circuits, which do not require cleaning after said use; oxidation chemicals for protecting the surface to which they are applied for use in connection with solder; silver/glass die attach material adhesives for use in silicon chip binding; chemical preparations for soldering, namely, solder fluxes, soldering injection chemicals to reduce oxide formation on bridge conduction lines, surface conditioning chemicals to prepare surfaces for soldering; protective chemical coatings to maintain solderability of surfaces; ultraviolet curable polymers for use in legend inks, solder masks and etching/plating resists; soldering chemicals, namely, aqueous resist stripper for use in the printed circuit board industry; soldering chemicals, namely, aqueous machine descalers for use in the printed circuit board industry; chemical compounds, namely, resin coatings used as temporary solder masks to prevent the adherence of solder to base metals for use in the printed circuit board industry; and thermoplastic paste adhesives for use in the manufacture of electronic assemblies

rosin base protective coating to be used for the preservation of solderable metallic surfaces

organic solvents for cleaning and degreasing printed circuit boards; soldering and printed circuit chemicals, namely, alkali cleaners, degreasing solvents, flux remover, metal cleaner, paint strippers and varnish remover, wire stripping preparation for removing insulation from metal, silk screen ink remover, solder resist removing preparation; solvent and aqueous cleaners to remove residues and contaminants before and after soldering; chemical cleaner and rosin flux remover for use in rosin mildly activated paste applications

solder oil

tin and lead eutectic solder; water soluble organic flux cored solder wire; coated metal strip; solders composed primarily of lead and tin; dispenser filled with wire solder; bar, wire and core solder; laser cut metal stencils for use in the assembly of electronic components; solder metal alloy that is treated to inhibit dross formation and increase fluidity for use in soldering applications; pastes containing metal powder for use in copper brazing; cleaning compound for solder plated printed circuits; flux cored wire solder for use in the electronics industry

measuring device for determining the ionic content of liquids, namely, ionographs; automated megohmeters for testing the dielectric properties of non-conductive materials; anodes for electro-plating; deionizing unit for electronic components