TESSION

Machines for the assembly and packaging of electronic semiconductor chips; machines for manufacturing semiconductors, and structural parts and fittings therefor; semiconductor manufacturing machines; semiconductor manufacturing machines and systems composed of a vacuum chamber for accommodating semiconductor wafers and structural parts and machines for handling and transferring semiconductor wafers into and out of vacuum chamber, and structural parts and fittings therefor; machines for the treatment of semiconductor wafers, namely, semi-conductor wafer processing equipment; industrial robots for the handling of semiconductor wafers; machines for the assembly and packaging of electronic chips; industrial chemical reactors; industrial robots; machines and equipment for the plasma assisted manufacture of semiconductor devices, namely, vacuum treatment machines for plasma assisted deposition, and vacuum machines for depositing fine films; plasma enhanced deposition machines; and structural parts and fittings therefor

Electrical reactors for processing semiconductor wafers; reactors for processing semiconductor wafers, namely, chemical reactors for the thermal treatment of semiconductor wafers and reactors for chemical vapor deposition; electronic controllers for the semiconductor industry; electronic control systems for semiconductor manufacturing machines; laboratory chemical reactors; robots being electronic control devices, namely, laboratory robots; electronic control systems for machines; semiconductor wafer processing equipment, namely, plasma-enhanced deposition reactors; electronically operated apparatus for the manufacture of semiconductors and for the deposition of thin films on semiconductor wafers by plasma-enhanced deposition; and structural parts and fittings for the aforementioned goods