TELKEM

SOLDERING FLUXES, I.E., ORGANIC SOLDERING FLUXES AND RESIN SOLDERING FLUXES, COLD FLUX REMOVERS, METAL DEOXIDATION SOLUTIONS, SOLDERING FLUX NEUTRALIZERS, FUSING COMPOUNDS SUCH AS ARE USED BY HEAT MEDIUMS FOR REFLOWING SOLDER PLATES, DROSS INHIBITORS IN SOLDER POTS; THINNING SOLVENTS, I.E., SOLVENTS FOR OILS, I.E., TINNING OILS SUCH AS THOSE USED TO RETARD SOLDER OXIDATION AND TO REDUCE SOLDER SURFACE TENSION; AND PROTECTIVE COATINGS, I.E., COMPPOSITIONS FOR METAL SURFACES AND SOLDER RESIST

CLEANING SOLVENTS, I.E., DESGREASING SOLVENTS; METAL CLEANERS, I.E., SURFACE ACTIVE AGENTS FOR CLEANING OXIDATION, ETCH RESIDUE AND OTHER ORGANIC AND INORGANIC CONTAMINATION FROM COPPER, GOLD, TIN, TIN-NICKEL, SOLDER AND SILVER PLATED SURFACES AS A PREPARATION FOR SOLDERING OR ADDITIONAL PLATING; AND FOR LIQUID WIRE STRIPPERS, I.E., CHEMICALS CONTAINING PHENOLS AND PHENOLIC DERIVATIVES FOR DISSOLVING OR LIFTING WIRE INSULATIONS SUCH AS ENAMEL, AND OTHER AMIDE-IMIDE TYPE INSULATIONS