Mark Identification

TECTONIC 3D

Serial Number

98466619

Filing Date

Mar 25, 2024

Trademark by

TECTONIC-3D SWIP B.V.

Classification Information

Chemicals and Chemicals for industrial use; Polypropylene, for use in the following fields: Additive manufacturing, namely, 3D printing; Polypropylene reinforced with carbon fibres, for use in the following fields: Additive manufacturing, namely, 3D printing; Chemicals, for use in the following fields: Additive manufacturing, namely, 3D printing; Chemicals, namely, Granules and Powders, for use in the following fields: Additive manufacturing, namely, 3D printing; PLA (polylactic acid), ABS (acrylonitrile butadienestyrene), PETG (polyethylene terephthalate glycol), PA11 (polyamide11), PC/ABS (polycarbonate/acrylonitrile butadiene styrene), PPO (polyphenylene oxide), TPC (thermoplastic copolyester), PEEK (polyether ether ketone), PEKK (polyetherketoneketone), PI (polyamide), for use in the following fields: Additive manufacturing, namely, 3D printing

Chemicals

Plastic filaments for 3D printing: Plastic filaments for 3D printing; Semi-processed PLA (polylactic acid) filaments, for use in the following fields: 3D printing; Semi-processed ABS (acrylonitrile butadiene styrene) filaments, for use in the following fields: 3Dprinting; Semi-worked thermoplastic filaments for use in 3D printing; Semi-processed thermoplastic filaments, granules, powder and pellets, for use in the following fields: 3D printing; plastic filaments or pellets for use in 3D printing; Polymer composite materials in the form of extruded pellets, rods, powders, strands and filaments; Semi-finished polymers, namely, Pellets; PLA filaments, for use in the following fields: 3D printing; ABS filaments for use in the following fields: 3D printing; Thermoplastic filaments used for 3D printing; PETG (polyethylene terephthalate glycol) filaments, for use in the following fields: 3D printing; Thermoplastic polyester filaments, for use in the following fields: 3D printing; Thermoplastic polymers, for use in the following fields: 3D printing; PA11 (polyamide11) filaments, for use in the following fields: 3D printing; PC/ABS filaments (polycarbonate/acrylonitrile butadiene styrene), for use in the following fields: 3D printing; PPO (polyphenylene oxide) filaments, for use in the following fields: 3D printing; PC filaments (polycarbonate), for use in the following fields: 3D printing; TPC (thermoplastic copolyester) filaments, for use in the following fields: 3D printing; High-quality plastic filaments in terms of strength, longevity, heat resistance and minimal moisture absorption, for use in the following fields: 3D printing; PEEK (polyetherether ketone) filaments, for use in the following fields: 3D printing; PEKK (polyetherketoneketone) filaments, for use in the following fields: 3D printing; PI filaments (polyamide), for use in the following fields: 3D printing; Thermoplastic powders, for use in relation to the following goods: 3D printers; Powders containing polyamide, for use in relation to the following goods: 3D printers; Powders containing PEKK/PEEK, for use in relation to the following goods: 3D printers; Plastic powders, for use in relation to the following goods: 3D printers

Rubber Goods

Design services, Engineering services, Investigation services and services in the field of technological development in the following fields: Additive manufacturing, namely, 3D printing; Material testing, in the following fields: Additive manufacturing, namely, 3D printing; Research and development of new products for others in the field of plastics and waste for the manufacture of additives; Development of material applications for additive manufacturing (3D printing), with a focus on products related to additive manufacturing (3D printing); Technological consultancy, in the following fields: Additive manufacturing, namely, 3Dprinting; Quality checking, in the following fields: Additive manufacturing, namely, 3D printing; Electronic data storage, for use in the following fields: Additive manufacturing, namely, 3D printing

Computer and Scientific