TECDIA

Semiconductor wafer processing equipment; Precision machine tools for use in the cutting and forming of sapphires, silicon carbide, gallium arsenide, gallium nitride and indium phosphide in the fields of LED and Laser Diode manufacturing; Machine parts, namely, nozzles which are parts of power-operated sprayers; Nozzles for particle blast cleaning machines and structural parts thereof

Electric resistors; Integrated circuits; Capacitors; RF, microwave and light wave components, namely, bias tees; Electrical power boards, namely, DC power boards