STACKPAC

Housings for electrotechnical devices, modules and components; encapsulated housing for electrotechnical devices, modules and components; housings and encapsulated housings for electric or electronic devices, modules and components; housings and encapsulated housings for electric or electronic components comprising integrated circuits; housings and encapsulated housings for electric or electronic modules, for electric or electronic sensors, for electric or electronic displays; electronic devices, modules and components received in a housing; electronic devices, modules and components received in an encapsulated housing; electric or electronic devices, modules and components comprising integrated circuits received in a housing or in an encapsulated housing; electric or electronic modules, electric or electronic sensors, electric or electronic displays received in a housing or in an encapsulated housing; any of the afore-mentioned housings for information technology, audio-visual and multimedia technology, communication technology, data storage devices and media, data processing equipment, for apparatus and instruments for the control of electricity, for optical devices, for safety, security, protection and signalling devices, for navigation, guidance, tracking, targeting, and map-making devices, for measuring, detecting, monitoring and controlling devices, for controllers and regulators, for sensors, detectors and monitoring instruments, for data loggers and recorders

Custom manufacture and assembly services as well as custom manufacturing of goods to the order and specification of others in relation to housings and encapsulated housings for electrotechnical devices, modules and components, in relation to housings and encapsulated housings for electric or electronic components comprising integrated circuits, for electric or electronic modules, for electric or electronic sensors, for electric or electronic displays, in relation to electronic devices, modules and components received in a housing or received in an encapsulated housing, in relation to electric or electronic devices, modules and components comprising integrated circuits, electric or electronic modules, electric or electronic sensors, electric or electronic displays and received in a housing or in an encapsulated housing, any of the afore-mentioned housings for information technology, audio-visual and multimedia technology, communication technology, data storage devices and media, data processing equipment, for apparatus and instruments for the control of electricity, for optical devices, for safety, security, protection and signalling devices, for navigation, guidance, tracking, targeting, and map-making devices, for measuring, detecting, monitoring and controlling devices, for controllers and regulators, for sensors, detectors and monitoring instruments, for data loggers and recorders; custom manufacture and assembly services as well as custom manufacturing in relation to replacement parts of the afore-mentioned goods