73395509
Sep 30, 1982
Jul 3, 1984
Ceramic Micro-Electronic Packaging Structural Components-Namely, Ceramic Multi-Layer Semi-Conductor Packages, Glass Sealed Semi-Conductor Packages, Dual-In-Line Packages, Flat Packs, Leaded Chip Carriers, Leadless Chip Carriers, Hybrid Packages and Standard Substrates
Electrical and Scientific Apparatus