SOITEC

Semiconductor substrates for opto-electronics, micro-electronics, and micro-engineering, namely, semiconductor chips, integrated circuits, transistors, capacitors, filters for radiofrequency bandwidth selection, oscillators, electric switches, electric resistors, amplifiers, and electronic memories; semi-conductor wafers; semi-conductors; silicon wafers and semiconductors for integrated circuits and derived activities; semiconductor wafers for light-emitting diodes, radio frequency (RF) components and for power components; substrates for micro-electronics, opto-electronics, micro-engineering, light-emitting diodes, micro-systems, photovoltaics, integrated optical guides, sensors, integrated circuits, radio frequency (RF) and power components, namely, semiconductor chips, integrated circuits, transistors, capacitors, cable connectors, filters for radiofrequency bandwidth selection, oscillators, electric switches, electric resistors, amplifiers, and electronic memories

Treatment of materials by means of annealing, thermal annealing, rapid thermal annealing, laser annealing, oxidation, implantation for layer exfoliation, grinding, chemical and physical layer deposition in the nature of electrophoretic coating services, epitaxy, and bonding of material for layer transfer; Treatment of substrates by means of glass substrate polishing, grinding, chemical treatment of surface to remove particles and/or contaminants, laser irradiation, plasma treatment in the nature of applying plasma finishes, amorphization, re-crystallization, etching, chemical etching, plasma etching, carbonization, smoothing by means of plasma, heat treatment, plasma activation to hydrophilize surfaces, and hydrophilization for micro-electronics, opto-electronics, piezoelectric, photovoltaics, microsystems and radio frequency (RF) components; treatment of semiconductor wafers and semiconductors by means of laser beams, plasma in the nature of applying plasma finishes, annealing, and chemical treatment of surface to remove particles and/or contaminants; polishing of semiconductor wafers, transfer of layer by exfoliation; treatment of silicon wafers and semiconductors by means of laser beams, plasma in the nature of applying plasma finishes, annealing, and chemical treatment of surface to remove particles and/or contaminants; polishing of silicon wafers and semiconductors, transfer of layer by exfoliation

Scientific, technological, technical and industrial research in the field of material science for micro-electronics, opto-electronics, piezo electronics and micro-engineering, photovoltaics, microsystems and radio frequency (RF) components provided by engineers; testing of materials; laboratory work for others, namely, materials testing and scientific research and development; research and development of new products for others; scientific research and development in the field of wafers and semiconductors for opto-electronic and piezo electronics components, photovoltaics, radio frequency (RF) components, power components, micro-engineering, and micro-systems; scientific research and development in the field of silicon wafers and semiconductors for integrated circuits and derived activities; scientific research and development in the field of the transfer of micro-electronic circuits or micro-systems on all media; engineering and engineering services in the field of semiconductor wafers and semiconductors for micro-electronic, opto-electronic, piezo-electronic radio frequency (RF), micro-mechanical, photovoltaic components, memories, power components; engineering and engineering services in the field of silicon wafers and semiconductors for integrated circuits and derived activities and the transfer of micro-electronic or opto-electronic circuits or micro-systems on all types of media; research for the development of new products in the field of semiconductor wafers for the manufacture of electronic devices, for the manufacture of transistors, memories, diodes, photodiodes, light-emitting diodes, photodiode detectors, radio frequency (RF) components and micro-systems; assistance and technical support, namely, technical advice in the field of development of new products in the field of semiconductor wafers for the manufacture of electronic devices, for the manufacture of transistors, diodes, photodiodes, light-emitting diodes, photodiode detectors, radio frequency (RF) components and micro-systems