SMIC
Mark Identification

SMIC

Serial Number

85281163

Filing Date

Mar 30, 2011

Registration Date

Oct 30, 2012

Trademark by

SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION

Active Trademark

Classification Information

Semiconductors and integrated circuits, semiconductors and integrated circuits, namely, application-specific integrated circuits, logic chips, mixed signal chips and memory chips; parts and chip packaging for semiconductors and integrated circuits, namely, application-specific integrated circuits, logic chips, mixed signal chips and memory chips; packaged semiconductors and integrated circuits, namely, application-specific integrated circuits, logic chips, mixed signal chips and memory chips; photo masks; integrated circuit cards and boards; wafers, namely, those comprising germanium/silicon; transistors; magnetic coded cards for use in consumer electronic products; printed circuits; blank smart cards and sim cards for use in consumer electronic products; microdisplay devices, namely, liquid crystal displays on silicon panel; epoxy probe cards for use in testing

Electrical and Scientific Apparatus

Custom manufacture of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices; manufacture of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, to the order and/or specification of others; wafer, semiconductor and integrated circuit manufacturing, assembling and packaging services to the order and/or specification of others; semiconductor and integrated circuit cutting, molding and etching to the order and/or specification of others; integrated circuit wafer foundry services to the order and/or specification of others; integrated circuit photo mask and electronic chip or computer chip manufacturing to the order and/or specification of others; wafer, chip and semiconductor manufacturing to the order and/or specification of others, integrated circuit assembling services to the order and/or specification of others; silicon wafer photolithography, etching, thin film, diffusion, ion implanting and chemical mechanical polishing services to the order and/or specification of others; manufacture of printed circuits to the order and/or specification of others; photo mask manufacturing services to the order and/or specification of others; wafer probing services to the order and/or specification of others; manufacture of microdisplay devices, including liquid crystal on silicon devices, to the order and/or specification of others; manufacture of smart cards and sim cards to the order and/or specification of others

Treatment of Materials

Design of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, for others; custom design of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, to the specification of others; simulation, namely, testing, verification and analysis of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, for others; design of printed circuits for others; photo mask design services for others; design of microdisplay devices, including liquid crystal on silicon devices, for others; design of smart cards and sim cards for others

Computer and Scientific