S

Machines and machine tools for the manufacturing and processing of micro-structure elements; automated machines and systems for cleaning, coating, developing, etching and strip coating of substrates, especially semiconductor substrates, hard discs, silicon discs, wafers, photomasks, hardmasks or embossing masks, templates, structure masks and substrates; semiconductor wafer processing machines; machines for wafer bonding; machines for debonding; machines, namely coating machines for coating micro-structure elements and nano-structure elements; machines, namely mask aligners; mask aligners [manufacturing machines], namely micro and nano imprinters; lithographic machines for the processing of micro-structure or nano-structure elements; laser machines for the semiconductor industry; photomask and wafer processing machines for the semiconductor industry; photomask and wafer processing machines for photomask applications; photomask and wafer processing machines for the manufacturing and processing of opto-electronics; photomask and wafer processing equipments for the manufacturing and processing of semiconductor back-ends (MEMS); photomask and wafer processing equipments for the manufacturing of organic light emitting diodes (OLED).

Control software for machines in the field of manufacturing and processing semiconductors and printed circuits and microstructural elements; projection scanner for projection lithography; optical scanners; optical printers.