RUDOLPH

METROLOGY INSPECTION SYSTEMS COMPRISED OF ONE OR MORE LIGHT SOURCES, ONE OR MORE CAMERAS AND/OR SENSORS IN COMMUNICATION WITH COMPUTER SOFTWARE AND HARDWARE USED FOR THE MEASUREMENT OF THICKNESSES, ADHESION PROPERTIES, AND STRUCTURAL PROPERTIES OF SEMICONDUCTOR MATERIALS AND FOR MONITORING THE PERFORMANCE OF SEMICONDUCTOR FABRICATION PROCESSES; INSPECTION EQUIPMENT AND ASSOCIATED SOFTWARE FOR THE SEMICONDUCTOR INDUSTRY, NAMELY, OPTICAL INSPECTION EQUIPMENT FOR 2D AND 3D INSPECTION OF SEMICONDUCTOR MATERIALS; AND SOFTWARE FOR THE SEMICONDUCTOR INDUSTRY, NAMELY, SOFTWARE FOR IDENTIFYING DEFECTS IN SEMICONDUCTOR STRUCTURES, SOFTWARE FOR IDENTIFYING SEMICONDUCTOR FABRICATION PROCESS EXCURSIONS, SOFTWARE FOR RECORDING AND REVIEWING DEFECTS IN SEMICONDUCTORS STRUCTURES, SOFTWARE FOR IDENTIFYING ROOT CAUSES OF DEFECTS IN SEMICONDUCTOR STRUCTURES, AND SOFTWARE FOR CONTROLLING AND MONITORING SEMICONDUCTOR FABRICATION EQUIPMENT