RECON

Integrated circuit packages for semiconductors, namely, ball grid array and land grid array chip packages consisting of supporting boards on which balls are gridded array; substrates for semiconductors, namely, supporting board on which integrated circuits, chip condensers and chip capacitors are attached or embedded; ball grid array and land grid array chip packages, namely, supporting boards on which balls are gridded arrayed; conductive substrate for flexible printed circuit board; electronic components, namely, resistor networks in a ball grid array and land grid array package