79378214
Jun 26, 2023
Sensors for 2D imaging, 3D imaging, localisation, mapping and multispectral imaging; vision sensors for 2D imaging, 3D imaging, localisation, mapping and multispectral imaging; image sensors for 2D imaging, 3D imaging, localisation, mapping and multispectral imaging; infrared sensors for 2D imaging, 3D imaging, localisation, mapping and multispectral imaging; light sensors for 2D imaging, 3D imaging, localisation, mapping and multispectral imaging; optical sensors for 2D imaging, 3D imaging, localisation, mapping and multispectral imaging; image processors for 2D imaging, 3D imaging, localisation, mapping and multispectral imaging; image processing apparatus for 2D imaging, 3D imaging, localisation, mapping and multispectral imaging; semiconductors; semiconductor devices; chips [integrated circuits]; system on a chip [SoC]; cameras; infrared cameras
Electrical and Scientific ApparatusDesign and development of sensors, vision sensors, image sensors, infrared sensors, light sensors, optical sensors, image processors, image processing apparatus, virtual and augmented reality hardware, semiconductors, semiconductor devices, integrated circuit chips, system on a chip [SoC], cameras and infrared cameras for 2D imaging, 3D imaging, localisation, mapping and multispectral imaging; research in the area of semiconductor processing technology; technical consultancy in relation to the production of semiconductors, sensors and integrated circuit chips for use in connection with 2D imaging, 3D imaging, localisation, mapping and multispectral imaging; research and development of new products for 2D imaging, 3D imaging, localisation, mapping and multispectral imaging
Computer and Scientific