QP TECHNOLOGIES

Microelectronic assemblies comprising electronic and mechanical components in the nature of semiconductor devices, bond wire, electric wire, etched metal leadframes, namely, capacitors, electric resistors, MEMS devices being chips fabricated from semiconductor or non-semiconductor materials, VCSELs being laser diodes, and also utilizing dice, adhesives for industrial use, and semiconductor grade encapsulants and molding compounds, being sold as a unit