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Scientific equipment and computers for use in thermal management, namely, non-electric heat dissipaters sold as a component part in computers; fans, vortex generators, turbulators, heat baffles, and guide vanes for use as component parts in computers and scientific equipment for use in dissipating heat and regulating thermal conditions in computers and scientific equipment; air and liquid cooled heat sinks sold as a component part in computers and scientific equipment for use in computers and scientific equipment; heat exchangers, heat spreaders, heat pipes, [ thermo-syphons, ] vapor-chambers, cold plates, [ thermo-electric and peltier cells, phase change materials, ] all for use in computers and scientific equipment; scientific instruments for use in development and design of thermal management products, namely, flow phenomena visualization devices and equipment, namely, smoke generators, [ bubble generators and inkjets; ]and wind tunnels for use in flow and thermal testing of electronic systems; [ ovens, ] still air enclosures, and cold plates, all for use in thermal testing of electronic systems; liquid crystal thermal imaging devices for use in thermal characterization of dies, components, boards and systems; velocity and temperature measuring devices, namely, [ shadowgraph devices, schlieren devices, interferometry devices, halographic interferometry devices, particle image velocimetry devices, laser Doppler velocimetry/anemometry devices,] liquid crystal imagining devices, infra-red devices, manometer devices, Pitot tube devices, Pitot-static tube devices, orifice plate devices, pressure transducers, hot wire anemometers, thermocouple devices, resistance temperature detectors, resistance thermometers, [ thermistors, thermal test dies, heat flux gages, clorimeters, thermopiles, shear stress gauges, strain gages, and long bars, ] all for use in flow and thermal testing of electronic systems and thermal characterization of dies, components, boards and systems; computer software for use in flow and thermal testing of electronic systems and thermal characterization of dies, components, boards and systems that is used in analyzing data from parametric studies; computer software for use in performing parametric studies in the field of thermal management, and for selecting thermal management products for purchase

Technical consultation in the field of thermal management for use with electronic components; testing and design of new products for others, namely testing and design of thermal management products for use with electronic components and board and system components