POWERSEMI

Providing grinding, polishing, lapping, sawing and slicing services for semi-conductor wafers, substrates, and silicon carbide for others

Grinding, polishing, lapping, sawing and wire slicing machines; Grinding, polishing, lapping, sawing and slicing machines for processing semi-conductor wafers and substrates; Grinding, polishing, lapping, sawing and slicing machines for processing semi-conductor silicon carbide

Retail and online retail store services featuring silicon carbide