POWERLEAN

Thermo-electric cooling devices comprised of Peltier cooling chips, heat sinks, electronic controllers and connections, and air movers for cooling enclosures that house CPUs, semiconductors, integrated circuits and other computer parts and components

Thermo-electric cooling devices comprised of Peltier cooling and heating apparatus, heat sinks, air movers, and electronic controllers and connections, and air movers for enclosures that house electrical and electronic industrial and HVAC equipment