POWER RIBBON

[ METAL AND COMPOSITE METAL BONDING MATERIALS, SUCH AS ALUMINUM, COPPER, NICKEL, GOLD, SILVER, PALLADIUM, OR PLATINUM AND CLAD MATERIALS FROM AT LEAST TWO OF THE FOREGOING BONDING MATERIALS IN RIBBON, TAPE, OR STRIP FORM, FOR USE IN SEMICONDUCTOR DEVICES, MICROELECTRONIC DEVICES AND COMPONENTS, AND BONDING MACHINES ]

BONDING MACHINES FOR SEMICONDUCTOR DEVICES, MICROELECTRONIC DEVICES AND COMPONENTS

ELECTRICAL BONDING MACHINES FOR ELECTRICALLY CONNECTING METAL OR OTHER CONDUCTIVE ELEMENTS; SEMICONDUCTOR DEVICES, MICROCOMPUTERS AND INTEGRATED CIRCUITS AND COMPONENTS FOR THE FOREGOING