PLAS FINE PER

ETCHING RESIST, PLATING RESIST, SOLDER RESIST, FILING RESIN USED FOR MANUFACTURING PRINTED CIRCUIT BOARD; PHOTOSENSITIVE DRY FILMS FOR USE IN THE MANUFACTURE OF PRINTED CIRCUITS, NAMELY, DRY FILM PHOTORESIST; AND PHOTOSENSITIVE CHEMICALS, NAMELY, LIQUID PHOTOIMAGEABLE SOLDER RESIST, AND ELECTRODEPOSITED PHOTORESIST