Mark Identification
PILLAR BUMP
Serial Number
75734567
Filing Date
Jun 21, 1999
Trademark by
Classification Information
TRADEMARK INDICATES A CONNECTION BUILD UP BY ELECTROPLATING CONDUCTIVE MATERIAL ON INTEGRATED CIRCUITS (IC) AT THE WAFER LEVEL AND CIRCUIT BOARD OR LAMINATES THIS CONNECTION IS CALLED PILLAR BUMP BECAUSE OF THE TALL HEIGHT BUILD UP AND FLEXIBLE COMPOSITION ACHIEVED DURING ELECTROPLATING
Treatment of Materials