PHOTOFINER

Chemicals for use in the process of producing printed circuit boards, namely, solder mask, etching resist, hole plugging materials, and interlayer materials for forming dielectric layers in the process of producing printed circuit boards, and build-up boards

Inks for use in the process of producing printed circuit boards, namely, marking inks, etching resist inks, printing inks, hole plugging inks, and solder resist inks; inks for printing in the process of producing package application boards; inks for printing in the process of producing flexible printed boards; inks for printing in the process of producing display panels; and coating for use in the process of producing printed circuit boards, namely, interlayer insulating coating, namely, interlayer insulating coating for use in the process of producing package application boards; interlayer insulating coating for use in the process of producing flexible printed boards; and interlayer insulating coating for use in the process of producing display panels, namely, build-up substrate thermal curable interlayer insulating coating, build-up substrate interlayer insulating coating, and thermal curable interlayer insulating coating

Electrical insulating materials for use in coating or printing in the process of producing printed circuit boards, namely, insulating resin materials for use in the process of producing build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use in the process of producing build-up boards; insulating coating materials for use in the process of producing display panels; insulating materials for providing solder mask in the process of producing printed circuit boards; interlayer insulation materials for use in the process of producing build-up boards, namely, liquid resin, resin film, resin coated copper foil, pre-preg; and interlayer insulation materials for use in the process of producing printed circuit boards, namely, liquid resin, resin film, resin coated copper foil, pre-preg