Wire bonding tool, namely, capillary, for semiconductor wire bonding and manufacturing machines; Semiconductor manufacturing machines and apparatus for semiconductor wire bonding and die bonding; Pick up tool for moving semiconductor wafer die for use in manufacturing machines for semiconductors; Tool holding collets for use in semiconductor manufacturing machines; Machine parts, namely, micro nozzle for use in semiconductor manufacturing machines; Epoxy dispensing tool for use in semiconductor manufacturing machines; Ejector tool for separating semiconductor wafer die for use in semiconductor manufacturing machines; Machine apparatus, namely, machines for manufacturing semiconductors; Semiconductor wafer processing machines; Apparatus for adjusting and setting machining tools; Robots for industrial use; Machines and machine tools, namely, industrial robots; Metalworking machines; Ejector pin for use in semiconductor manufacturing machines; Machines for processing non-metallic mineral
Machinery