PECO

Semiconductor manufacturing machines; Semiconductor wafer processing machine; Machinery, namely, semiconductor wire bonding equipment; Semiconductor manufacturing machine parts, namely, capillaries, wedges, die collets, ejector pins, vacuum cups, vacuum pick-up and disc drive tools, electrodes, wires, hooks, probes, EFO Electronic Flame-Off torches and die ejection accessories, namely, adaptor, magnetic bars, pin holders and caps; Semiconductor die bonders used in manufacturing semiconductors; Machines for mounting semiconductor chips and semiconductor components; High precision dispense and assembly equipment for the semiconductor industry; Ceramic parts and tools for semiconductor manufacturing process, namely, ceramic collets, ceramic pick-up tools, wafer handling arms, ceramic tweezers, vacuum chucks, ceramic plates, anti-plasma plates