PACTECH MEMBER OF NAGASE GROUP

Contact metalizations for microconnections made from soldering material, included in class 6, namely, soldering wire of metal for microconnections

Mechanical apparatuses, in particular automatic machines, with regard to microperipheric technologies, namely, semiconductor wafer processing machines; mechanical apparatuses, in particular automatic machines, for the application of connecting materials on substrates; mechanical apparatuses, in particular automatic machines, for manufacturing microconnections, in particular for the production of substrate units from one or more substrates joined as one module, in particular chips

Material treatment of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates

[ Development of contact metallizations for connection systems, namely, new product development for others regarding contact metallization; development of connection systems for manufacturing microconnections, namely, development of new technology for others in the field of computer systems for microconnection manufacturing; technology consulting services, in particular with regard to manufacturing microconnections, namely, consulting services in the field of designing of machines for manufacturing microconnections and in the field of development of new technology regarding microconnection manufacturing and applicability ]