ONTO INNOVATION

Scientific instruments, based principally upon optical microscope, electron microscope, spectrophotometer, ellipsometer and scanning slit densitometer technology, for metrology purposes, namely, apparatus for measuring physical dimensions of samples and thicknesses of deposited films or for analyzing chemical composition of materials; Metrology inspection equipment for use in the manufacturing, inspection, testing and repair of semiconductor substrates; Metrology inspection equipment and devices, namely, instruments and devices that sense and capture images of semiconductor components, semiconductor wafers, semiconductor die, packaged integrated circuits, printed circuit boards, liquid crystal displays, electronic displays, and disk storage media, and inspect these images for defects, coordinate or position determination, identification, or presence or absence of a feature, characteristic or substance thereon; Metrology inspection systems comprised of one or more light sources, one or more cameras and/or sensors in communication with computer software and hardware used for the measurement of thickness, adhesion properties, and structural properties of semiconductor materials and for monitoring the performance of semiconductor fabrication processes; Optical inspection equipment for 2D and 3D inspection of semiconductor materials; Metrology instruments metrology purposes, namely, apparatus for measuring physical dimensions of samples and thicknesses of deposited films or for analyzing chemical composition of materials, consisting of optical microscope, electron microscope, spectrophotometer, ellipsometer and scanning slit densitometer technology

Software for the semiconductor industry, namely, software for identifying defects in semiconductor structures, software for identifying semiconductor fabrication process excursions, software for recording and reviewing defects in semiconductors structures, software for identifying root causes of defects in semiconductor structures, and software for controlling and monitoring semiconductor fabrication equipment